CORWIL Technology Corporation

About CORWIL



CORWIL was founded in 1990 to provide high quality and responsive IC assembly and test services to the semiconductor, OEM electronics, military and aerospace, and medical industries. Excellent quality and superior service have been the hallmarks of CORWIL's success. As a result, CORWIL has emerged as the premier and most diversified provider of its various services, including wafer thinning and dicing, optical inspection, and full assembly and testing of IC's and complex modules.

Our quality has led CORWIL to be the manufacturer of choice in high cost of failure and high reliability market segments, such as the medical and mil/aero markets where quality and reliability are the most important factors.

CORWIL is the strategic manufacturing resource for its customers and is fully integrated into its customers' manufacturing operations. In most cases, CORWIL is either the sole source manufacturing partner for its customers or is an embedded part of their product development and manufacturing processes. Because of its quality and service, and its technical capabilities, CORWIL has served more than 1000 loyal customers.

CORWIL's modern new facility, in the heart of Silicon Valley, California, was designed and constructed for optimum quality and efficient production.

Volume Production

CORWIL is the highest volume subcontractor of wafer dicing, visual inspection, and die pick & place services in the US, producing tens of millions of die per month for its customers. For commercial markets, such as communications, imaging, PC, and consumer/industrial, CORWIL's IC assembly and test production capabilities range from plastic packages such as QFN's, to complex BGA's and multi-chip-modules. Additionally, for the mil/aero markets, CORWIL assembles and tests IC's in ceramic packages including full mil-spec process flows and environmental screening. CORWIL is certified QML (Qualified Manufacturers List) by the U.S. Government for mil-spec (Class B or Level Q) IC assembly and test. QML certification for space level (Class S or Level V) IC assembly and test is in process.

Prototypes & Pre-Production

For quick-turn prototyping, CORWIL is unsurpassed in producing highly complex products such as Flip Chip or wirebonded BGA or chip-scale devices with thousands of bumps or wire bonds. For new product development, where time-to-market is of utmost importance, especially in highly competitive markets, CORWIL customers will request quick-turns as fast as 8 to 24 hours. This leads to faster introduction of customers' products into the market resulting in greater market share and increased profitability for our customers. CORWIL is the sole source provider of prototyping services in Flip Chip and wire bonded BGA's for many fabless companies as well as full IDMs (Integrated Device Manufacturers with wafer fabs) and OEM's with application specific devices. CORWIL also is the designated provider for pre-production quantities, overflow production, and for end-of-quarter or end-of-year production surges for many customers.

Technology at CORWIL

CORWIL continues to stay at the leading edge of manufacturing technology. CORWIL has organized its engineering group to allow its process experts to focus on specific disciplines such as wire bonding, Flip Chip assembly, plastic molding, wafer thinning and dicing, and vision inspection so that CORWIL is the best-in-class in the industry for those specific disciplines.

CORWIL's technical leadership has made it the first subcontractor in the U.S. in many areas such as BGA assembly, ultra-fine pitch wire bonding, 12 inch wafer dicing and thinning, and assembly of complex RF modules and multi-chip-modules such as SIP (system-in-package). Long recognized as the industry technical leader in high volume, chip-free and fast turn-around wafer dicing, CORWIL is not resting on its laurels. CORWIL's proprietary Dice-Before-Grind (DBG) process produces the unquestioned highest quality dice in the world, particularly for ultra-thin wafers. Also known as BackGrind After Saw (BGAS), this process is extremely important in the markets requiring more and more electronic functionality in smaller and smaller packages through stacked die and multi-chip-module packaging. In all of these areas, CORWIL is one of the leaders in the industry, worldwide.

CORWIL also works with its customers during the package design phase to assure manufacturability of customers' end products. CORWIL's unique substrate and package design experience has enabled our customers to bring new product configurations to market, beating their competition with innovative packaging solutions.

Quality, Reliability & Service you can Trust

Superior IC assembly and test services begin with superior quality systems. CORWIL is certified or registered to the most rigorous quality standards in the world including ISO 9001:2000 and the U.S. Government QML (Qualified Manufacturers List) for mil/aero and space-level IC assembly and test. This culture of quality began with the founding of CORWIL in 1990 and continues to this day as one of the most important ingredients to serving our customers.

CORWIL is the answer to your IC assembly and test subcontracting needs.

We would appreciate the opportunity to work with you. Please contact us.