2017 Press Releases
- March 8, 2017 - CORWIL Technology Invests in Portable Clean Environment for Wafer Sort
- February 2, 2017 - CORWIL Technology Increases Volume Tape and Reel Capabilities
- January 18, 2017 - CORWIL Technology Adds up to 50 Ghz in RF Test
2016 Press Releases
- October 19, 2016 - CORWIL Technology Receives Trusted Accreditation
- April 27, 2016 - CORWIL Technology Increases Wafer Sort Capability
- March 16, 2016 - CORWIL Technology Receives a Perfect Scorecard from Device Engineering Incorporated
- February 16, 2016 - CORWIL Technology Increases Wire Bond Capabilities
2015 Press Releases
- July 21, 2015 - CORWIL Technology Receives Excellent Performance Report Card from Microsemi Corporation
- June 18, 2015 - CORWIL Technology Producing Volume Plastic Parts Including MicroSD and QFN
- May 6, 2015 - CORWIL Technology Receives Quality Management System Certification to SAE AS9100 Rev C.
- March 11, 2015 - CORWIL Technology Test, Reliability and EOL Services
- February 4, 2015 - CORWIL Technology Selected as Supplier of the Year by Inphi Corporation
2014 Press Releases
- December 18, 2014 - CORWIL Technology Corporation Combines Assembly and Test in One Location
- May 12, 2014 - CORWIL Technology Corporation Awarded ISO 13485 Certification for Medical Devices
- March 31, 2014 - CORWIL Increases Die Attach Capacity with a New MAT 6400
- March 10, 2014 - CORWIL Technology Corporation Completes Asset Purchase of VIKO Test Labs
- March 4, 2014 - CORWIL Increases Die Sorting/Plating Capability
- February 3, 2014 - CORWIL Technology Completes ISO 13485 Certification Audit
2013 Press Releases
- November 22, 2013 - CORWIL Increases Molding Capabilities with a FICO MMS-W Molding System
- October 29, 2013 - CORWIL Announced the Addition of a NEW 300mm Backgrind System
- April 8 2013 - Tonka Bay Equity Partners Acquires CORWIL Technology Corporation
- Dicing Advanced Materials for Microelectronics - Annette Teng Cheung, Ph.D.
- Medical Device Wafer Singulation - Annette Teng, Ph.D. and Finn Wilhelmsen, Ph.D.
- Dicing Die Attach Films for High Volume Stacked Die Application - Annette Teng Cheung, Ph.D.