See What CORWIL Has to Offer

Posted by Susan Campbell on Tue, Aug 15, 2017 @ 09:19 AM

In response to the requests we’ve received about our processes and types of equipment we have, CORWIL has created a Youtube Channel to show you what we do.

Not seeing what you're looking for? We will be growing our video library as requests come in. 

Have a question? Give us a call or e-mail.


CORWIL Adds FTI 1000 Tester - Good to 3600V and Testing of Power Devices

Posted by Susan Campbell on Tue, May 23, 2017 @ 09:48 AM

CORWIL Technology (CORWIL) has teamed with Focused Test, Inc. to release the FTI 1000. The FTI 1000 tester adds to a growing variety of testers on the CORWIL test floor capable of both package test and wafer sort. The FTI 1000 is a perfect solution for testing power discrete devices, power management IC’s and Intelligent Power Modules. In addition to standard silicon devices, FTI 1000 is capable of testing Wide Band Gap devices using GaN and SiC technologies. FTI 1000 is capable of performing a wide range of DC, thermal resistance and AC tests on power discrete devices.

corwil-fti-1000.jpgThe MOSFET AC parameters tested by the FTI 1000 include Inductive Load (UIL/UIS), Gate Charge (Qg, Qgs, Qgd), Gate Resistance (Rg), Gate Capacitance (Cg, Ciss, Coss, Crss) and high voltage Switching/Timing Tests. The FTI 1000 also offers analog test resources to enable Smart Power devices to be tested, such as Half Bridge power modules. FTI 1000 can also perform Dynamic Rdson testing on GaN HEMT wide band gap discrete devices.

The FTI 1000 performs IC and Multi-Chip Module testing using the IC Channel Board equipped with: 

  • Multiple Quad VI’s
  • TMU
  • Pulse Generators
  • Comparators
  • Digital Instruments
  • C Bits with Readback

Additional channel boards can be easily added, depending on the required configuration, and each channel board can be synchronized by a cabled ‘Sync Bus’.

“We have had a number of customers ask about high voltage and discrete testing.  This FTI solution works well, providing scalability and flexible solutions.  We were pleased when Focused Test collaborated with us on this program.” Said Joe Foerstel, CORWIL’s VP of Test.

Focused Test, Inc. (FTI) was founded in August 2006, with the mission to apply a ‘focused technology’ approach to the design of engineering and production testers for power discrete devices and analog IC’s. Our goal is to offer targeted solutions that meet our customers’ needs for low-cost, flexible and scalable test equipment for specific product segments in the power and intelligent power markets. In this way, we provide the lowest acquisition price and highest throughput, along with an impressive array of test engineering tools.

“CORWIL’s extensive assembly and test capabilities have enabled us to provide a full range of test services to power device manufacturers in the Bay Area and we are very pleased with the excellent results of our collaboration to date”, said Peter Hancock, President of Focused Test, Inc.

CORWIL's Commitment to it's Customers

Posted by Susan Campbell on Mon, May 08, 2017 @ 10:46 AM

When CORWIL was approached by a medical customer that had developed a product that required a very small and strong die, CORWIL collaborated with them to utilize Dice Before Grind (DBG) in order to adhere to the customer’s very tight and unconventional package requirements. Using DBG reduced die breakage and chipping that can be caused by conventional methods.

CORWIL’s commitment to problem solving, delivering quality products and acquiring the best equipment resulted in a happy customer as well as CORWIL successfully taping 1 million die in the month of March on their recently attained Muhlbauer Tape and Reel system.


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Device Test and Package Solutions for Silicon Photonics

Posted by Susan Campbell on Wed, Apr 12, 2017 @ 09:36 AM

corwil-silicon-photonicsCORWIL Technology’s pursuit of cutting edge technology and prime location in the heart of Silicon Valley has led them to secure programs from leaders in the area of Silicon Photonics. The need to increase bandwidth in all aspects of hardline and wireless communications coupled with an increase in data center speed is driving the communication world away from copper interconnects and towards silicon photonics. This evolving technology uses a combination of fiber optics, optical wave guides and laser frequency light waves, to carry far more data than traditional copper conductors, to support faster data transfer rates between data centers.

Because silicon photonics is a new field, customers are approaching device test and package solutions in different ways. There are many new processes and capabilities that are being put in place and developed to join the various components at the package level, along with work in device test at both the die and package level. Many of the services CORWIL offers are being performed for multiple customers and their silicon photonics based products. CORWIL has been providing Die Prep services including scribe and break, dicing, back grind, inspection as well as Package Assembly and wafer sort and package test services. Some of the unique requirements have pushed CORWIL to develop unique expertise in our service offerings.

In the area of Test, CORWIL is working with multiple customers on methods to test a device via a fiber optic input that can be used in a volume production environment for both package test and wafer sort. To be able to test at the high speeds and data rates these devices are rated for, CORWIL has developed methods to perform the initial RF VNA calibrations down through the wafer probes, using industry standard automated wafer probers vs. the semi-automated probe stations that are more often used.

For Device Reliability, CORWIL has worked with several silicon phontonics customers to come up with innovative methods to stress the actual device/die while inputting a controlled light source. Given the harsh environments of HAST and HTOL these requirements continue to push CORWIL’s engineering staff to continue to innovate.

“As this is a new competitive field, CORWIL leverages the knowledge gained becoming a Trusted facility to offer customers anonymity, secrecy and security to protect any proprietary customer IP that is consigned to CORWIL,” said Joe Foerstel, VP of Test for CORWIL Technology.

CORWIL Technology looks forward to continuing its partnership in the communications industry and becoming a vital source in providing test services to ensure the effective implementation of silicon photonics and its progressive technology.




CORWIL in Chip Scale Review

Posted by Susan Campbell on Wed, Mar 22, 2017 @ 05:05 PM
Read about CORWIL in this month's issue of Chip Scale Review!


Interested in learning more about CORWIL? We'd like to hear from you! Request a quote

CORWIL Invests in Portable Clean Environment

Posted by Susan Campbell on Wed, Mar 08, 2017 @ 09:00 AM

corwil-clean-roomTo satisfy customer demand for ultra-clean environments for wafer sort, CORWIL Technology (CORWIL) has added a Portable Clean Environment for wafer sort that is good to Class 1000. CORWIL’s one-stop solution from wafer sort, die prep, assembly, Package Test and Reliability provides the ability to understand how different pieces of the backend process affect each other in terms of yield.

Joe Foerstel, VP of Test for CORWIL said, “Customers have found that wafer sort in a very clean environment improves yield, especially when using certain RF probe technologies or probing devices with sensitive surface structures; particularly for our customers in the communications and medical industries.”  “We have seen dramatic improvement of yields at Second Optical when customer’s wafers arrive from a cleaner environment, especially when back grind is one of the steps in the process,” added Jonny Corrao, CORWIL’s Director of Die Prep.

For more information on CORWIL’s wafer sort capabilities and the Portable clean environment please contact CORWIL 408.618.8700.


CORWIL Technology Receives Trusted Accreditation

Posted by Susan Campbell on Wed, Oct 19, 2016 @ 07:53 AM
Milpitas, CA, October 19, 2016 – CORWIL Technology (CORWIL), headquartered in Milpitas, CA, has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for the Department of Defense (DoD) and all other U.S. Government customers. This Trusted Accreditation award includes Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.

corwil-trusted-accreditationCORWIL has served the DoD, U.S. Government agencies and major prime contractors in providing state-of-the-art microelectronics packaging services with military and aerospace reliability. DMEA serves as a technology partner to military program managers and engineering liaison to all sectors of the defense contractors to provide and support the most effective microelectronics technologies available through the commercial sector.

“The Trusted Partner Accreditation is yet another key milestone in our business strategy to further our commitment in quality services and processes for the military and aerospace sector,” said Matt Bergeron, CORWIL Technology President. “CORWIL is honored to be one of the few companies offering Trusted Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.”

Certificate: Defense Microelectronics Activity (DMEA) Accreditation of Trust


Medical Electronics Symposium 2016

Posted by Susan Campbell on Tue, Aug 30, 2016 @ 08:00 AM

Visit us at SMTA's Medical Electronics Symposium, September 14 & 15 at Marylhurt University in Portland, Oregon. This year's Key Note Speakers include:

  • The President's Precision Medicine Initiative: The Opportunities and Challenges of Analytics on Integrated Data from One Million Patients, Bob Rogers, Intel Corporation
  • Electronic Materials and Devices for Neural Applications, Mohammad Reza Abidian, Ph.D., University of Houston
  • Functional Electronic Clones & China's plan to Dominate the Semiconductor-Manufacturing Industry, Tom Sharpe, SMT Corporation

Stop by the CORWIL booth and say hello and find out what CORWIL Technology can do for you!



Reliability Testing from CORWIL Technology

Posted by Susan Campbell on Wed, Jul 20, 2016 @ 08:00 AM

What's NEW...chroma-3650-ex

  • CORWIL can now perform ALL JESD22-A113 Precondition work IN-HOUSE, as well as
    before and after CSAM with the Sonoscan D9000.  
  • CORWIL has taken delivery of a NEW Chroma 3650 EX Tester, 1024 channels, 96 DPS


Focused Test FTI 1000 Test System

High Voltage Supply: 1,200V, 100mA (70VA max), (expandable to 3,600V)
High Power Supply: 100A pulsed, 4A continuous 55V compliance (expandable to 200A)
Low Leakage Measurements: <10nA
Digitizer – Dual Channel: 25 MS/s
TMU: 625ps resolution
Quad VI Boar: 40V, 100mA

Capable of performing package final test or wafer sort on:


Power discrete devices:

- GaN and SiC Power Transistors
- Bipolar Transistors
- Thyristors/SCR
- Diodes/Rectifiers

Intelligent Power Modules/DrMOS:

- Regulators (PWM, LDO, etc.)
- Motor/Solar Controllers
- Battery Chargers
- Drivers ( MOSFET, LED, etc.)
- Temperature Management

Analog IC devices

CORWIL-reliability-test We Want to Hear From You!


Call: 408.618.8700

Dice Before Grind (DBG) for Medical Devices

Posted by Jonny Corrao on Thu, May 12, 2016 @ 12:11 PM

CORWIL was recently approached by a medical customer who had developed a tiny wearable device that included a small bare die with innovative packaging. The product required a very small and strong die due to the customer’s very tight and unconventional package requirements. The die were on a 300mm wafer and had tight streets and low-k dialectrics.

Knowing that the backside and edge quality were key, the CORWIL team used Dice Before Grind (DBG) to reduce die breakage and chipping typically caused by the conventional method. DBG reverses the usual process of fully dicing the wafer after grinding. In DBG, the wafer is first trenched, or partial-cut, to a depth greater than the final target thickness. The wafer is then thinned to the final target resulting in die separation. After grind, the wafer goes to the in-line DBG Mounter, which mounts the wafer and gently peels off the protective grinding tape, completing the process.

Since the die are singulated at the final target thickness, wafer-level breakage is greatly reduced. Additionally, as a result of the die separation occurring during the grinding process, the backside chipping associated with thin-wafer dicing is kept to a minimum. DBG can also provide improved die strength depending on the application. For these reasons, DBG is an excellent process for processing wafers with high-quality backside requirements.

Top: DBG Bottom: No DBG