Environmental & Electrical Test

CORWIL's Test Services include:

Environmental Test

  • Full Mil-Std-883

  • Method 5004/4004 testing (Class B and Class S)

Software Development

Custom test software development is available for CORWIL's digital test systems. We will work with consigned test systems and benchbox test setups as well.

Probecard & Interface Card Design & Fabrication

CORWIL can design and procure custom probe cards for wafer probing your IC wafers. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes.

Wafer Electrical Probe

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. The available test platforms can be either CORWIL's in-house test system or customer-supplied test systems.

Final Test

CORWIL is capable of performing final-part test for a variety of IC packages, including custom modules. As with wafer probe, the available test platforms can be CORWIL's in-house test system or customer-supplied.

CORWIL is QML listed and ITAR registered for Environmental Screening!

  • Full Mil-Std-883, Method 5004/5005 Testing (Class B and Class S)
  • All tests are performed in DSCC and ISO9001:2000 Certified Facilities in accordance with Military Standards

The following are some of the more common tests:

Particle Impact Noise Detection Testing (PIND)

Method 2020, Condition A & B

Stabilization Bake

Method 1008, Conditions A - D

Temperature Cycling

Method 1010, Conditions A - C

Centrifuge/Constant Acceleration

Method 2001, Conditions A - E

Fine & Gross Leak Testing

Method 1014, Conditions A1 & C1

Bond Strength (destructive)

Method 2011

Non Destructive Bond Pull

Method 2023

Die Shear Strength

Method 2019

Substrate Attach Strength (stud pull)

Method 2027

Burn-In

Method 1015, Conditions A - E

Lid Torque (glass frit seal)

Method 2024

Thermal Shock

Method 1011, Conditions A - C

Mechanical Shock

Method 2002, Conditions A - G

Salt Atmosphere

Method 1009, Conditions A - D

Solderability

Method 2003

Moisture Resistance

Method 1004

Lead Integrity

Method 2004, Conditions B1, B2 & D

Resistance to Solvents

Method 2015

Other tests are listed in CORWIL's DSCC Laboratory Suitability Letter.