IC Assembly
IC Assembly Highlights
CORWIL partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.
CORWIL understands that time is of the essence in this fast-paced technology. We use state-of-the-art machines in our facility to support and turn many different types of IC assemblies in as quickly as 4 hours. Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide!
CORWIL's capabilities include:- Ultra-fine pitch bonding
- A wide variety of QFN packages
- For BGAs - all Ball Configurations, Wire Counts, and Body Sizes
- For Custom and Module assemblies - Customer or CORWIL supplied substrates
- Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
- Standard cycle time: 5 working days; Quick-turns as fast as 4 hours
CORWIL is always looking to the future and investing in new equipment to match our customers' needs, help them stay ahead of product life cycles, and keep them on the forefront of emerging markets and technologies.
CORWIL's IC Assembly services include:
-
Wafer electrical probe
-
Full wafer preparation:
- Wafer grinding, thinning and polishing (75mm to 300mm wafer diameters)
- Wafer sawing and dicing (the first U.S. supplier to offer 300mm dicing and DBG - dice before grind)
- Die plating and pick and place
- Die inspection - manual and automated
-
IC package engineering & assembly:
- Die attach
- Wire bond (Aluminum and Gold)
- Flip Chip
- Encapsulation and transfer mold
- Substrate solder ball attach
- Device Singulation
Standard IC Packages Available
-
Hermetic & Ceramic
From wafer to finished product, CORWIL can deliver in as quickly as 4 hours! CORWIL assembles all types of hermetic and ceramic packages including:
- PGAs (pin-up or pin-down configurations-with and without heat sinks)
- Sidebraze
- Cerquad
- Quad Flat-Pack
- Cerdip, Cerpak
- Flat-Pack
- Ceramic SOIC
- LLC
- JLCC (PLCC equivalent)
- Metal Cans
- Headers
-
Plastic
CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages! Plastic Open Cavity package equivalents are available for:
- TSSOP
- MSOP
- SOIC
- PQFP
- And other package configurations
-
BGA
CORWIL's Ball Grid Array assembly capabilities include:
- Ultra-fine pitch bonding
- All Ball Configurations, Wire Counts, and Body Sizes
- Customer or CORWIL-supplied substrates
- Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
- Substrate design and fabrication
-
Flip Chip
CORWIL's Flip Chip product capabilities include:
- Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB)
- Organic laminates or ceramic substrates
- Single or multiple Flip Chip and wire-bonded IC's in hybrids or multi-chip modules
- Bonding of solder bumped dice to substrates with an accuracy as tight as 5 microns
- Solder joints are reflowed in nitrogen under tight temperature control and reflow profiles are available for eutectic and also for lead-free solder
- Gold stud bumping
- Studded die can be thermosonically joined to customer substrates, or soldered using a gold tolerant solder
-
QFN & DFN
CORWIL can assemble your IC die into a wide range of QFN and DFN options:
- Leadframes ranging from 3x3mm to 12x12mm body sizes
- Pin counts from 8 to 88 leads
- Custom leadframe design and fabrication in as little as 3 weeks
-
SIP/MCM Modules
CORWIL can design your custom module. Our multi-component assembly options include:
- Stacked die
- SMT components
- Package-on-package
- Combined Flip Chip
- Wirebond structures
Let CORWIL show you how we can meet ALL your IC assembly requirements!