CORWIL Production Types Available
CORWIL is the highest volume subcontractor of wafer dicing, visual inspection, and die pick & place services in the US, producing tens of millions of die per month for its customers. For commercial markets, such as communications, imaging, PC, and consumer/industrial, CORWIL's IC assembly and test production capabilities range from plastic packages such as QFN's, to complex BGA's and multi-chip-modules. Additionally, for the mil/aero markets, CORWIL assembles and tests IC's in ceramic packages including full mil-spec process flows and environmental screening. CORWIL is certified QML (Qualified Manufacturers List) by the U.S. Government for mil-spec (Class B or Level Q) IC assembly and test. QML certification for space level (Class S or Level V) IC assembly and test is in process.
Prototypes & Pre-Production
For quick-turn prototyping, CORWIL is unsurpassed in producing highly complex products such as Flip Chip or wirebonded BGA or chip-scale devices with thousands of bumps or wire bonds. For new product development, where time-to-market is of utmost importance, especially in highly competitive markets, CORWIL customers will request quick-turns as fast as 8 to 24 hours. This leads to faster introduction of customers' products into the market resulting in greater market share and increased profitability for our customers. CORWIL is the sole source provider of prototyping services in Flip Chip and wire bonded BGA's for many fabless companies as well as full IDMs (Integrated Device Manufacturers with wafer fabs) and OEM's with application specific devices. CORWIL also is the designated provider for pre-production quantities, overflow production, and for end-of-quarter or end-of-year production surges for many customers.